Santa Clara University

Recent Publications

I. Journals

T. Yamada, F.R. Madriz, and C.Y. Yang, "Inductance in One-dimensional Nanostructures," IEEE Transactions on Electron Devices 56, 1834-1839 (2009). (Invited paper in Special Issue on Compact Interconnect Models for Giga Scale Integration)

F. R. Madriz, J. R. Jameson, S. Krishnan, X. Sun, and C. Y. Yang, "Circuit Modeling of High-Frequency Electrical Conduction in Carbon Nanofibers," IEEE Transactions on Electron Devices 56, 1557-1561 (2009).

T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, "Electrothermal Analysis of Breakdown in carbon Nanofiber Interconnects," IEEE Electron Device Letters 30, 469-471 (2009).

W. Wu, S. Krishnan, T. Yamada, X. Sun, P. Wilhite, R. Wu, K. Li, and C.Y. Yang, "Contract resistance in carbon nanostructure via interconnects," Applied Physics Letters 94, 163113 (1-3) (2009).

E.D. de Asis Jr., B. Nguyen-Vu, P.U. Arumugam, H. Chen, A.M. Cassell, R.J. Andrews, C.Y. Yang, and J. Li. "High efficient electrical stimulation of hippocampal slices with vertically aligned carbon nanofiber microbrush array," Biomed Microdevices, DOI 10.1007/s10544-009-9295-7 (2009) online at www.Springerlink.com.

M. Suzuki, Y. Ominami, T. Sekiguchi, and C.Y. Yang, “Secondary electron imaging of embedded defects in carbon nanofiber via interconnects,” Applied Physics Letters 93, 263110 (1-3) (2008).

M. Suzuki, K. Kumagai, T. Sekiguchi, A.M. Cassell, T. Saito, and C.Y. Yang, “Secondary electron emission from freely supported nanowires,” Journal of Applied Physics 104, 114306(1-6) (2008).

T. Saito, T. Yamada, D. Fabris, H. Kitsuki, P. Wilhite, M. Suzuki, and C.Y. Yang, "Improved contact for thermal and electrical transport in carbon nanofiber interconnects," Applied Physics Letters 93, 102108 (1-3) (2008).

Y. Ominami, M. Suzuki, K. Asakura, and C.Y. Yang, "Growth of Carbon Nanofibers on Nanoscale Catalyst Strips Fabricated with a Focused Ion Beam," Nanotechnology 19, 405302 (5pp) (2008).

H. Kitsuki, T. Yamada, D. Fabris, J. R. Jameson, P. Wilhite, M. Suzuki, and C.Y. Yang, "Length dependence of current-induced breakdown in carbon nanofiber interconnects," Applied Physics Letters 92, 173110(1-3) (2008).

Q. Ngo, T. Yamada, M. Suzuki, Y. Ominami, A. M. Cassell, J. Li, M. Meyyappan, and C.Y. Yang, " Structural and Electrical Characterization of Carbon Nanofibers for Interconnect Via Applications," IEEE Transactions on Nanotechnology 6, 688-695 (2007).

M. Suzuki, Q. Ngo, H. Kitsuki, K. Gleason, Y. Ominami, and C.Y. Yang, " Bright-field transmission imaging of carbon nanofibers on bulk substrate using conventional scanning electron microscopy," Journal of Vacuum Science & Technology B25, 1615-1621 (2007).

M. Suzuki, H. Kitsuki, Q. Ngo, T. Yamada, K. Gleason, Y. Ominami, B. Roth, M. Betts, A.M. Cassell, and C.Y. Yang, "Image Formation Mechanisms in Scanning Electron Microscopy of Carbon Nanofibers on Substrate," Microscopy & Microanalysis 13 (Suppl 2), 580-581 CD (2007).

M. Suzuki, Y. Ominami, Q. Ngo, A.M. Cassell, J. Li, and C.Y. Yang, "Current-induced breakdown of carbon nanofibers," Journal of Applied Physics 101, 114307(1-5) (2007).

M. Suzuki, T. Yamada, and C.Y. Yang, "Monte Carlo Simulation of SEM Bright-contrast Images of Suspended Carbon Nanofibers," Applied Physics Letters 90, 083111(1-3) (2007).

Q. Ngo, A.M. Cassell, V. Radmilovic, J. Li, S. Krishnan, M. Meyyappan, and C.Y. Yang, "Palladium catalyzed formation of carbon nanofibers by plasma enhanced chemical vapor deposition," Carbon 45, 424-428 (2007).

M. Suzuki, Y. Ominami, Q. Ngo, and C. Y. Yang, T. Yamada, A.M. Cassell, and J. Li, "Bright contrast imaging of carbon nanofiber-subtrate interface," Journal of Applied Physics 100, 104305(1-5) (2006).

Y. Ominami, Q. Ngo, M. Suzuki, A.J. Austin, C.Y. Yang, A.M. Cassell, and J. Li, "Interface Characteristics of Vertically Aligned Carbon Nanofibers for Interconnect Applications," Applied Physics Letters 89, 263114-1-3 (2006).

Y. Ominami, Q. Ngo, N.P. Kobayashi, K. Mcilwrath, K. Jarausch, A.M. Cassell, J. Li, and C.Y. Yang, "Bottom-up sample preparation technique for interfacial characterization of vertically aligned carbon nanofibers," Ultramicroscopy 106, 597-602 (2006).

Q. Ngo, A.M. Cassell, A.J. Austin, J. Li, S. Krishnan, M. Meyyappan, and C.Y. Yang, "Characteristics of Aligned Carbon Nanofibers for Interconnect Via Applications," IEEE Electron Device Letters 27, 221-224 (2006).

S. Yu, D.M. Petranovic, S. Krishnan, K. Lee, and C.Y. Yang,  "Loop-Based Inductance Extraction and Modeling for Multiconductor On-Chip Interconnects," IEEE Transactions on Electron Devices 53, 135-145 (2006).

Y. Ominami, Q. Ngo, A.J. Austin, H. Yoong, C.Y. Yang, A.M. Cassell, B.A. Cruden, J. Li, and M. Meyyappan, "Structural Characteristics of Carbon Nanofibers for On-chip Interconnect Applications," Applied Physics Letters 87, 233105 (2005).

Y. Ominami, Q. Ngo, H. Yoong, A.J. Austin, A.M. Cassell, B.A. Cruden, J. Li, M. Meyyappan, and C.Y. Yang, "Study of Metal-Carbon Nanofiber Interfaces for On-chip Interconnect Applications," Microscopy and Microanalysis 11 (Suppl 2), 1964-1965 (2005).

Q. Ngo, B.A. Cruden, A.M. Cassell, G. Sims, M. Meyyappan, J. Li, and C.Y. Yang, "Thermal Interface Properties of Cu-filled Vertically Aligned Carbon Nanofiber Arrays," Nano Letters 4, 2403-2407 (2004).

Q. Ngo, D. Petranovic, S. Krishnan, A.M. Cassell, Q. Ye, J. Li, M. Meyyappan, and C.Y. Yang, "Electron Transport through Metal-Multiwall Carbon Nanotube Interfaces," IEEE Transactions on Nanotechnology 3, 311-317 (2004).

S.-P. Sim, S. Krishnan, D. Petranovic, N. Arora, K. Lee, and C.Y. Yang, "A Unified RLC Model for High-Speed On-Chip Interconnects," IEEE Transactions on Electron Devices 50, 1501-1510 (2003).

S.-P. Sim, K. Lee, and C.Y. Yang, "High-Frequency On-Chip Inductance Model," IEEE Electron Device Letters 23, 740-742 (2002).

R. Kariyadan, N.A. Wong, K. Chan, S.P. Sim, and C.Y. Yang, "Modeling Inversion-Layer Carrier Mobilities in All Regions of MOSFET Operation," Solid-State Electronics 46, 153-156 (2002).

W. Feng, W.K. Choi, L.K. Bera, J. Mi, and C.Y. Yang, "Optical characterization of as-prepared and rapid thermal oxidized partially strain compensated Si1-x-yGexCy films," Materials Science in Semiconductor Processing 4, 655-659 (2001).

W.K. Choi, W. Feng, L.K. Bera, C.Y. Yang, and J. Mi, "Spectroscopic ellipsometry and electrical studies of as-grown and rapid thermal oxidized Si1-x-yGexCy films," J. Applied Physics 90, 5814-5824 (2001).

M. Miura-Mattausch, H.J. Mattausch, N.D. Arora, and C.Y. Yang, "MOFSET Modeling Gets Physical," IEEE Circuits and Devices Magazine 17, No.6, 29-36 (2001).

L.K. Bera, W.K. Choi, W. Feng, C.Y. Yang, and J. Mi, "Electrical Properties of Rapid Thermal Oxides on Si1-x-yGexCy Films," Applied Physics Letters 77, 256-258 (2000).

W.K. Choi, L.K. Bera, J.H. Chen, W. Feng, K.L. Pey, H. Yoong, J. Mi, F. Zhang, and C.Y. Yang, "Structural Characterization of Rapid Thermally Oxidized Silicon-Germanium-Carbon Alloy Films," Materials Science and Engineering B75, 184-186 (2000).

W.K. Choi, J.H. Chen, L.K. Bera, W. Feng, K.L. Pey, J. Mi, C.Y. Yang, A. Ramam, S.J. Chua, J.S. Pan, A.T.S. Wee, and R. Liu, "Structural Characterization of Rapid Thermal Oxidized Si1-x-yGexCy Alloy Films grown by Rapid Thermal Chemical Vapor Deposition," J. Applied Physics 87, 192-197 (2000).

 

II. Conference Proceedings

T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, “Electrothermal Transport in Carbon Nanofiber Interconnects,” Proceeding of the 16th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Suzhou, China, July 6-10, 2009, pp. 146-149.  (invited paper)

X. Sun, K. Li, W. Wu, T. Saito, and C.Y. Yang, “Effect of Catalyst and Underlayer Metal on PECVD Growth of Vertically Aligned Carbon Nanotubes,” Proceedings of 2009 IEEE Nanotechnology Materials and Devices Conference, Traverse City, Michigan, June 2-5, 2009, pp.1 -2.  (invited paper)

T. Saito, H. Yabutani, T. Yamada, P. Wilhite, and C.Y. Yang, "Electrode and Substrate Contacts in Carbon Nanofiber Interconnects," Proceedings of 2009 IEEE International Interconnect Technology Conference, Sapporo, Japan, June 1-3, 2009, pp. 125-127. 

F.R. Madriz, J.R. Jameson, S. Krishnan, X. Sun, and C.Y. Yang, “Test Structure to Extract Circuit Models of Nanostructures Operating at High Frequencies,” International Conference on Microelectronic Test Structures,” Oxnard, CA, March 31 - April 2, 2009, pp. 36-38.

D. Fabris, T. Saito, T. Yamada, X. Sun, P. Wilhite, and C.Y. Yang, “Current Capacity and Thermal Transport in Carbon Nanofiber Interconnects,” Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Shenzhen, China, January 5-8, 2009, pp. 829-834.  (invited paper)

T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, “Effect of Current Stressing on Horizontal Carbon Nanofiber Interconnects,” 25th International ULSI Multilevel Interconnection Conference Proceedings, Fremont, CA, October 27-30, 2008, pp 296-298.  (invited paper)

H.Kitsuki, T. Saito, T. Yamada, D. Fabris, P. Wilhite, M. Suzuki, and C.Y. Yang, “Analysis of Carbon-based Interconnect Breakdown,” Proceedings of the 9th International Conference on Solid-State and Integrated Circuit Technology, Beijing, October 20-23, 2008, pp. 530-533.  (invited paper)

D. Fabris, T. Yamada, J. Gonzalez Cruz, H. Kitsuki, X. Sun, and C.Y. Yang, "Temperature modeling for carbon nanofiber breakdown," Proceedings of 2008 ASME Summer Heat Transfer Conference, Jacksonville, FL, August 10-14,  2008, HT2008-56244 (7pp).

Hirohiko Kitsuki, Tsutomu Saito, Toshishige Yamada, Drazen Fabris, John R. Jameson, Patrick Wilhite, Makoto Suzuki, and Cary Y. Yang, “Current-carrying Capacity of Carbon Nanofiber Interconnects,” Proceedings of the International Conference on Electronic Materials 2008, Sydney, Australia, July 28 - August 1, 2008.  (invited paper)

Hirohiko Kitsuki, Tsutomu Saito, Toshishige Yamada, Drazen Fabris, John R. Jameson, Patrick Wilhite, Makoto Suzuki, and Cary Y. Yang, "Current-carrying Capacity of Carbon Nanofiber Interconnects," Proceedings of 2008 IEEE International Interconnect Technology Conference, Burlingame, California, pp. 43-45, June 1-4, 2008.

Francisco Madriz, John R. Jameson, Shoba Krishnan, Kris Gleason. Xuhi Sun, and Cary Y. Yang, "Measurement and Circuit Model of Carbon Nanofibers at Microwave Frequencies," Proceedings of 2008 IEEE International Interconnect Technology Conference, Burlingame, California, pp. 138-140, June 1-4, 2008.

Hirohiko Kitsuki, Makoto Suzuki, Quoc Ngo, Kristofer Gleason, Patrick Wilhite, Toshishige Yamada, Alan M. Cassell, Jun Li, and Cary Y. Yang, "Carbon Nanofibers under High-current Stress for Interconnect Applications," 24th International VLSI Multilevel Interconnection Conference Proceedings, Fremont, CA, September 24-27, 2007.

Quoc Ngo, Toshishige Yamada, Kris Gleason, Alan M. Cassell, and Cary Y. Yang, "Electrothermal Modeling of Transport in Carbon Nanostructures," Proceedings of IEEE NANO 2007, Hong Kong, August 3-5, 2007. (invited paper)

Hirohiko Kitsuki, Makoto Suzuki, Quoc Ngo, Kristofer Gleason, Patrick Wilhite, Alan M. Cassell, Jun Li, and Cary Y. Yang, "Current-induced Breakdown of Carbon Nanofibers for Interconnect Applications," Proceedings of IEEE NANO 2007, Hong Kong, August 3-5, 2007.

Hirohiko Kitsuki, Makoto Suzuki, Quoc Ngo, Kristofer Gleason, Alan M. Cassell, Yusuke Ominami, Christopher R. Moylan, Jun Li, and Cary Y. Yang, "High-Current Reliability of Carbon Nanofibers for Interconnect Applications," Materials Research Society Symp. Proc. 1018, 1018-EE10-07 (2007).

M. Suzuki, Y. Ominami, Q. Ngo, T. Yamada, B. Roth, M. Betts, A.M. Cassell, J. Li, and C.Y. Yang, "Bright Contrast Imaging of Carbon Nanofiber-Substrate Interface using Scanning Electron Microscopy," Materials Research Society Symp. Proc. 963 , 0963-Q05-13 (2007).

M. Suzuki, Y. Ominami, Q. Ngo, and C.Y. Yang, "In situ Electron Microscopy Study of Current-induced Failure of Carbon Nanofibers," Proceedings of the 32nd International Symposium for Testing and Failure Analysis, Austin, November 12-16, 2006, pp. 521-524.

E. de Asis, Q. Ngo, A. Seger, L. Wang, W.K. Wong, M.S. Isaacson, and C.Y. Yang, "Carbon-based Nanostructures as Interconnects in Electrical and Biological Systems," Proceedings of the 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Shanghai, October 23-26, 2006, pp. 326-329. (invited paper)

E. de Asis, Q. Ngo, W.K. Wong, M.S. Isaacson, and C.Y. Yang, "Carbon Nanostructures as Interconnect and Interface Materials," Proceedings of IEEE Nanotechnology Materials and Devices Conference 2006, Gyeongju, October 22-25, 2006, pp. 146-147. (invited paper)

Q. Ngo, Y. Ominami, A. M. Cassell, J. Li, M. Meyyappan, and C.Y. Yang, "Temperature-dependent Characteristics of Carbon Nanofiber Arrays," Proceedings of IEEE NANO 2006, Cincinnati, July 17-20, 2006.

Y. Ominami, Q. Ngo, M. Suzuki, K. Mcilwrath, K. Jarausch, A.M. Cassell, J. Li, and C.Y. Yang, "Interface Characterization for Vertically Aligned Carbon Nanofibers for On-Chip Interconnect Applications," Proceedings of the 2006 International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, July 3-7, 2006, pp. 291-294.

A. Seger, E. de Asis, W.K. Wong, L. Wang, K. Kagoo, J. Hieb, M. Isaacson, and C.Y. Yang, "Characterizing Neuronal Networks Using Carbon Nanotube Microelectrode Arrays," Proceedings of NanoBio 2006, San Francisco, June 19-21, 2006.

Q. Ngo, S. Krishnan, A.M. Cassell, Y. Ominami, J. Li, M. Meyyappan, and C.Y. Yang, "Electrical Characterization of Carbon Nanofibers for On-chip Interconnect Applications," Proceedings of IEEE NANO 2005, Nagoya, July 11-15, 2005, pp. 585-588. (invited paper)

Y. Ominami, Q. Ngo, A.J. Austin, A.M. Cassell, B.A. Cruden, J. Li, M. Meyyappan, and C.Y. Yang, "Nanostructural Characterization of Carbon Nanofibers for On-chip Interconnect Applications with Scanning Electron Microscopy," Proceedings of IEEE NANO 2005, Nagoya, July 11-15, 2005, pp. 835-838.

Q. Ngo, B.A. Cruden, A.M. Cassell, G. Sims, J. Li, M. Meyyappan, and C.Y. Yang, "Nano-engineered Carbon Nanofiber-Copper Composite Thermal Interface Material for Efficient Heat Conduction," Proceedings of The Minerals, Metals and Materials Society Meeting, San Francisco, February 13-17, 2005, also in Surface Engineering in Materials Science III, Eds. A. Agarwal, N.B. Dahotre, S. Seal, J.J. Moore, and C. Blue, pp.75-82, TMS (2005).