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As the Thermal and Electrical Nanoscale Transport (TENT) project enters its third year, we are pleased to announce that the objectives of designing, fabricating, and characterizing test structures for carbon-based interconnect and thermal interface materials have been successfully met. In addition, funded by the U.S. Army through the TENT project, three major pieces of equipment have been either acquired from vendors or built in-house. These are: plasma-enhanced chemical vapor deposition (PECVD) system for growth of carbon nanostructures purchased from Aixtron, magnetron sputtering system for metal deposition purchased from AJA, and a thermal resistance measurement apparatus for thermal interface materials (TIM3) designed and constructed by TENT members. These advanced instruments, combined with existing equipment in the CNS labs, allow us to continue to produce research results that meet the project requirements, while at the same time create new knowledge in our quest to develop next-generation on-chip interconnect materials and high-performing thermal interface materials. So far, the TENT project has produced fifteen articles published in top-tier journals and fifty-five papers presented in international conferences, including seventeen invited papers.
The TENT team at Santa Clara University currently consists of the principal investigator, Dr. Cary Yang, three faculty co-investigators, a senior researcher, a lab manager, an administrative associate, four graduate students, and four undergraduate students. These individuals work closely with researchers from partner organizations at the University of California, Stanford, NASA Ames Research Center, Hitachi, and Radiance Technologies. "The TENT project is an example of working closely with government, industry, and academic partners on cutting-edge technology, while at the same time being a product of such collaborative effort," Yang said. "Everyone associated with the Center for Nanostructures has been benefiting from these partnerships, and we all look forward to contributing to the advancement of next-generation chip technology through this exciting project."
