Santa Clara University

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Monem H. Beitelmal

 

Title: Adjunct Associate Professor of Mechanical Engineering  Beitelmal, Monem H.
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Email: abeitelmal@scu.edu
Website: N/A
Education: Ph.D., Mechanical Engineering, Santa Clara University, Santa Clara, California, 2000 Graduated with Distinction
M.S., Mechanical Engineering, University of California, Davis, California, 1995
B.S., Mechanical Engineering, University of Portland, 1990

Biography

Dr. Beitelmal joined the Department of Mechanical Engineering at Santa Clara University in January 2009. Before joining Santa Clara University, Dr. Beitelmal spent nine years (2000-2008) as a research scientist at Hewlett-Packard Laboratories in Palo Alto California. Initially He worked on developing new cooling and packaging technologies for systems levels. Later and as a member of the HP Labs Smart Data Center research team, Dr. Beitelmal moved to a larger scale projects focusing on data center power and cooling research and design. The smart data center team research resulted in a suite of technologies notably HP Dynamic Smart Cooling products and services. Most recently he was a member of the Sustainable IT Ecosystem Laboratory at HP Labs working on the creation of sustainable IT products and services. At SCU, Dr. Beitelmal is focusing his effort to develop a strong energy and sustainability research program in collaboration with industry partners. He has authored over 25 published articles and over 10 HP technical reports. He is also an author of 44 granted patents and over 25 patent applications.

Current Research Interests

  • Data centers energy efficiency
  • Single and two-phase cooling technologies
  • Compact and energy efficient thermal management
  • Clean-coal technologies

Selected Publications

  1. Alyaser, A., Monaghan, R., Beitelmal, A.H., Fabris, D., “A Novel Reactor Concept: Indirectly Fired Integrated Gasification and Steam Generation System,” Accepted for presentation at the IMECE sustainable products and process session, Vancouver BC, Nov. 2010.
  2. Beitelmal, A.H., Patel, C.D., "A Steady-State Model for the Design and Optimization of a Centralized Cooling System," Accepted for publication in the International Journal of Energy Research, 2010.
  3. Wang, Z., McReynolds, A., Felix, C., Bash, C., Hoover, C., Beitelmal, A.H., Shih, R., “KRATOS: automated management of cooling capacity in data centers with adaptive vent tiles,” Proceedings of the ASME/IMECE, Lake Buena Vista, Florida, November, 2009.
  4. Beitelmal, A.H., Wang, Z., Felix, C., Bash, C., Hoover, C., McReynolds, A., “Local cooling control of data centers with adaptive vent tiles,” Proceedings of the InterPACK2009 conference, San Francisco, California, July 2009.
  5. Beitelmal, A.H., “Special issue on high density data centers-Editorial,” J. of Distributed and parallel databases-special issue on high density data centers, Vol. 21 No. 2-3, 2007.
  6. Beitelmal, A.H., Patel, C.D., “Thermo-fluids provisioning of a high density data center,” J. of Distributed and parallel databases-special issue on high density data centers, Vol. 21 No. 2-3, 2007.
  7. Beitelmal, A.H., Shah, A.J., Saad, M.A., “Analysis of an impinging two-dimensional jet,” J. of Heat Transfer, Vol. 128 no. 3, pp. 307, 2006.
  8. Patel, C.D., Sharma, R., Bash, C.E., Beitelmal, A.H., “Energy Flow in the Information Technology Stack: Introducing the Coefficient of Performance of the Ensemble,” Proceedings of the ASME/IMECE, Chicago, Illinois, 2006.
  9. Shen, J., Alyaser, M.H. and Beitelmal, A.H., “Turbulent heat transfer study of inclined impinging jets,” Proceedings of the Joint ASME National Heat Transfer Conference and AIAA, San Francisco, California, 2006.
  10. Pal, A., Joshi, Y.K., Beitelmal, A.H., Patel, C.D., Wenger, T.M., “Design and Performance Evaluation of a Compact Thermosyphon,” Proceedings of the IEEE Transactions of Components and Packaging Technologies, Vol. 25 No. 4, 601-607, 2002.
  11. Beitelmal, A.H., Michel, S.A. and Patel, C.D., “The Effect of Inclination on the Heat Transfer between a Flat Surface and an Impinging Two-Dimensional Air Jet,” Int. J. Heat and Fluid Flow, Vol. 21, pp. 156-163, 2000.
  12. Beitelmal, A.H., Michel, S.A. and Patel, C.D., “Effects of Surface Roughness on the Average Heat Transfer of an Impinging Air Jet,” Int. Comm. Heat Mass Transfer, Vol. 27, pp. 1-12, 2000.
  13. Beitelmal, A.H., Michel, S.A. and Patel, C.D., “Heat Transfer by a Two-Dimensional Air Jet Impinging Obliquely on a Flat Surface,” Proceedings of the ASME IMECE, Anaheim, California, 1998.
  14. Beitelmal, A.H., Michel, S.A. and Patel, C.D., “Heat Transfer of an Air jet Impinging on a Rough Surface,” Proceedings of the ASME National Heat Transfer Conference, HTD-Vol. 347, Baltimore, Maryland, 1997.
  15. Beitelmal, A.H. and Shaw, B.D., “Theory of the Effects of Small Gravitational Levels on Droplet Gasification,” Proceedings of the AIAA, Aerospace Science meeting and Exhibit, 95-0144, Reno, Nevada, 1995.

Patents Granted

  1. Correlation of airflow delivery devices and air movers, no. 7,682,234
  2. Cooling components across a continuum, no. 7,620,480
  3. Energy efficient CRAC unit operation using heat transfer levels, no. 7,584,021
  4. Air re-circulation effect reduction system, no. 7,568,360
  5. Method for predicting airflow rates, no. 7,558,649
  6. Small form factor air jet cooling system, no. 7,361,081
  7. Vent for a data center cooling system, no. 7,347,058
  8. Air-cooled heat generating device airflow control system, no. 7,315,448
  9. Correlation of vent tiles and racks, no. 7,313,924
  10. Designing layout for internet datacenter cooling, no. 7,313,503
  11. Correlation of vent tile settings and rack temperatures, no. 7,251,547
  12. Cooling system with a variable maximum operation level, no. 7,249,718
  13. Method for thermally managing a room, no. 7,218,996
  14. Controlled cooling of a data center, no. 7,114,555
  15. Method and apparatus for individually cooling components of electronic systems, no. 7,086,459
  16. Data center robotic device, no. 7,072,739
  17. Method and apparatus for individually cooling components of electronic systems, no. 7,013,968
  18. Energy efficient CRAC unit operation using heat transfer levels, no. 7,010,392
  19. Multi-load thermal regulating system having electronic valve control, no. 6,994,158
  20. Airflow volume control system, no. 6,981,915
  21. Cooling of data centers, no. 6,945,058
  22. Multi-load thermal regulating system with multiple serial evaporators, no. 6,926,078
  23. Method and apparatus for individually cooling components of electronic systems, no. 6,904,968
  24. Method and apparatus for individually cooling components of electronic systems, no. 6,876,549
  25. Cooling of data centers, no. 6,868,683
  26. Partition for varying the supply of cooling fluid, no. 6,862,179
  27. Cooling of data centers, no. 6,854,284
  28. Cooling of data centers, no. 6,834,512
  29. Cooling of data centers, no. 6,832,490
  30. Cooling of data centers, no. 6,832,489
  31. Modular spray jet cooling system, no. 6,817,204
  32. Cooling of data centers, no. 6,775,997
  33. Cooling of data centers, no. 6,772,604
  34. Pressure control of cooling fluid within a plenum using automatically adjustable vents, no. 6,694,759
  35. Multi-load thermal regulating system with multiple serial evaporators, no. 6,672,381
  36. Multi-load thermal regulating system having electronic valve control, no. 6,662,865
  37. Modular spray jet cooling system, no. 6,644,058
  38. Method, apparatus, and system for cooling electronic components, no. 6,628,520
  39. Smart cooling of data centers, no. 6,574,104
  40. Air jet cooling arrangement for electronic systems, no. 6,525,936
  41. Multi-load refrigeration system with multiple parallel evaporators, no. 6,490,877
  42. Multi-load refrigeration system with multiple parallel evaporators, no. 6,415,619
  43. Apparatus and method for air-cooling an electronic assembly, no. 6,134,108

Professional Service

  • Guest Editor, Distributed and Parallel Databases, Special Issue on High Density Data Centers, 2006, Elsevier Publications.
  • General chair and workshop organizer, HP First High Density Data Centers Workshop, Palo Alto California, April 2004.
  • Organizer, HP First Critical Facilities Workshop, Palo Alto California, April 2003.
  • Co-organizer, HP Annual Thermal Symposium, HP Annual Thermal Symposium, Palo Alto, California, 1996.

Awards

  • 2007 HP Award for outstanding efforts to train and educate important HP customers.
  • 2007 HP Award for outstanding efforts to the initial Dynamic Smart Cooling company-wide training and providing the background for the birth of DSC.
  • 2007 HP Award for expedient, exacting and execution on Dynamic Smart Cooling train the trainers program.
  • 2006 HP Award for business impact.
  • 2006 HP Award for an outstanding efforts in organizing and training product division partners.
  • 2005 HP Award for expedient, exacting and execution on Smart Data Center.
  • 2004 HP Award for technical help with strategic customer project.
  • 2004 HP Award for chairing the first HP high density data center workshop and heightened awareness of HP Labs research and technology.
  • 2004 HP Award for expedient, exacting and execution.
  • 2003 HP Award for contribution to the HP technical summer camp.
  • 2003 HP Outstanding achievement award.
  • 2002 HP Award for spirit of HP Labs.

Courses Taught

Undergraduate:

MECH 121 Thermodynamics
MECH 122 Fluid Mechanics
MECH 123 Heat Transfer
MECH 160 Engineering Instrumentations

Graduate:

MECH 225 Gas Dynamic I
MECH 226 Gas Dynamic II
MECH 228 Equilibrium Thermodynamics
MECH 288 Energy Conversion
MECH 345 Modern Instrumentation and Experiments