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Winter Seminar: Wednesday, January 23, 2013



Please mark your calendar for speaker T. Calvin Tszeng

Location: EC 326

Time: 4:00 - 5:00 p.m.

Date: 1/23/13

Topic: Residual stresses in engineering components


Residual stresses in engineering components originate from irreversible, non-uniform changes, like inelastic (plastic) deformations or structural changes (phase transformation). Uncontrolled residual stresses always appear in components due to manufacturing processes. Desirable compressive residual stresses, on the other hand, are implanted in critical components through various surface modification techniques for enhanced resistance to fatigue and stress corrosion. While sub-surface residual stress is critical to fracture resistance, bulk residual stress is responsible for excessive distortion during machining processes or during thermal loading. Knowledge of residual stress distribution in engineering components shall greatly improve predictions of component performance and geometrical stability. This talk is to give a brief look at state of the art in the following topics pertaining to residual stresses: processing techniques, thermal and mechanical stability, and measurement methods, including a very recent research on non-destructive measurement method for full-field 3D bulk residual stresses.


Dr. Tszeng is a Academic Year Adjunct Lecturer with Mechanical Engineering Department. He earned his Ph.D. degree from UC Berkeley. Dr. Tszeng used to be a faculty member at Illinois Institute of Technology, Chicago. Dr. Tszeng was the Principal Investigator of several research projects funded by US Department of Defense.