Santa Clara Universityand theSanta Clara Valley Electron Devices SocietyPresentIEEE Electron Devices Society Mini-Colloquium |
| Time | Topic | Speaker |
9:30 AM | Registration | |
9:45 AM | Welcome and Introduction | Prof. C. Yang and Dr. P. Jansen |
| 10:00 AM | Strain Engineering and Device Performance: Benefit or Compromise? | Prof. Cor Claeys IMEC, Belgium |
| 10:50 AM | Robust Electrostatic Discharge (ESD) Protection in CMOS Technology | Prof. Juin J. Liou University of Central Florida |
| 11:40 AM | High Mobility Materials and Novel Device Structures for High Performance Nanoscale MOSFETs | Dr. T. Krishnamohan Intel |
| 12:30 PM | Lunch and Student Poster Presentation | Dr. S. Saha and Dr. P. Jansen |
| 1:50 PM | RCL Characterization and Modeling of X Architecture Diagonal Wires for VLSI Design | Dr. N.D. Arora Cadence Design Systems |
| 2:40 PM | Recent Advances in Photonic Devices for RF/Wireless Communication Applications | Prof. Paul K. L. Yu UC San Diego |
| 3:30 PM | Coffee Break |
|
| 3:45 PM | FinFET Technology for Nanoscale CMOS Digital Integrated Circuits | Prof. Tsu-Jae King Liu UC Berkeley |
Sponsored by IEEE Electron Devices Society
